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LF353P Datasheet PDF - Texas Instruments

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LFN vs LFP feature comparison | Findchips

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Information of third parties may be subject to additional restrictions. TI has discontinued the production of the device. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

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Important Information and Disclaimer: Device is in production to support existing customers, but TI does not recommend using this part in a new design.

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