EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA

IGBT Power cycling and A combined power and e A combined power cycle Effect of YMnO3 on the JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.

POWER AND TEMPERATURE CYCLING | JEDEC

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The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed. It is intended to simulate worst case conditions encountered in typical applications. The power and temperature cycling test is considered destructive. It is intended for device qualification.

POWER AND TEMPERATURE CYCLING

Ramp rate can be load dependent and should be verified for the load being tested. NOTE Power duty cycle is usually expressed as a percentage. Sockets or other mounting means shall be provided within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration. Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.

The test circuitry should also be designed so that existence of abnormal or failed devices does not alter the specified conditions for other units on test. Care should be taken to avoid possible damage from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical overstress.

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The power should then be applied and suitable checks made to assure that all devices are properly biased. During the test, the power applied to the devices shall be alternately cycled 5 minutes on 5 minutes off unless otherwise specified in the applicable specification. The devices shall concurrently be cycled between temperature mesd22 for the specified number of cycles.

The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. The low temperature to high temperature transition or reverse sequence is acceptable. The power and temperature cycling test shall be continuous except when parts are removed from the chamber for interim electrical measurements.

If the test is interrupted as a result of power or equipment failure, the test may restart from the point of stoppage. The device shall be subjected to the test conditions derived from Table 1 as illustrated in Figure 1. Precautions should be taken to avoid electrical damage and thermal runaway.

Direct heat conduction to sample s shall be minimized. If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2.

The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.

Deviations must be corrected prior to further cycling to assure the validity of the qualification data. These include flip jsed22, ball grid array and stacked packages with solder interconnections. Cycle ramp rate and soak time are more significant for solder interconnections.

When testing these devices it is important jess22 avoid transient thermal gradients in the samples on test.

Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass. The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps.

For samples without a thermal mass constraint, the ramp rate can jesv22 faster. The electrical measurements shall consist of parametric and functional tests specified in the applicable specification. Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application. I rec ommen d cha nges to the fo llow in g: Re qu ire men t, c la use n umber T es t me thod nu mber C laus e number F a x: Rec ommend a tions fo r cor rec tion: O ther su gges tio ns for d ocu jjesd22 t impro vemen t: